Ball bond impedance matching
US12266629B2 · kind B2 · utility
0Cited by
18References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2021 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Feb 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.