Electronic device
US12266646B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 17, 2023 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | May 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.