Electrical interconnect with improved impedance
US12266878B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | Sep 24, 2021 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | Jul 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2421
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.