Daqiao Du
6Patents
0h-index
19Co-inventors
34Inventor score
Filing activity: Jun 16, 2017 → Sep 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12266878B2 | Electrical interconnect with improved impedance | Electricity | 0 | Active |
| US10157822B1 | Heterogeneous interconnect having linear and non-linear conductive pathways | Electricity | 0 | Active |
| US10950536B2 | Packed interconnect structure with reduced cross coupled noise | Electricity | 0 | Active |
| US12196807B2 | Near field wireless communication system for mother to package and package to package sideband digital communication | Electricity | 0 | Active |
| US10617000B2 | Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards | Electricity | 0 | Active |
| US10074919B1 | Board integrated interconnect | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.