Laser treatment system and method
US12269116B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Sep 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for the treatment of a region of an object adjacent to a substrate. The system includes a source of an incident laser beam delivering a focused laser beam. The wavelength of the incident laser beam is greater than the sum of 500 nm and of the wavelength associated with the bandgap of the material forming the substrate and smaller than the sum of 2,500 nm and of this wavelength. The system includes an optical device associating a digital aperture greater than 0.3 and means for correcting the spherical aberrations appearing during the crossing of the substrate for a given thickness of the substrate and a given distance between the substrate and the optical device. The processing being performed on the region through the substrate, and including the physical, chemical, or physico-chemical modification or the ablation of said region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.