Substrate treating liquid supply unit and substrate treating apparatus including the same
US12269273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/17566
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided are a substrate treating liquid supply unit for constantly maintaining a liquid level of a nozzle of an inkjet head unit through real-time water level measurement, and a substrate treating apparatus including the same. The substrate treating liquid supply unit includes: a first reservoir connected to an inkjet head unit for jetting a substrate treating liquid onto a substrate and providing the substrate treating liquid to the inkjet head unit; a water level sensor measuring a water level of the substrate treating liquid stored in the first reservoir; and a pressure control module compensating for a pressure provided to the first reservoir based on an amount variation in the water level of the substrate treating liquid, wherein a liquid level of a nozzle of the inkjet head unit is constantly maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.