Memory organization for multi-mode support
US12271597B2 · kind B2 · utility
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3References
15Claims
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Key dates
| Filing date | Nov 7, 2022 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Dec 3, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2207/107
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory package includes first, second, third, and fourth channels arranged consecutively in a clockwise direction on the memory package, each of the first, second, third, and fourth channels having access circuitry and memory arrays. In a first mode, the first channel controls access to the memory arrays in the second channel and the fourth channel controls access to the memory arrays in the third channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.