Integrated circuit packages with solder thermal interface materials with embedded particles
US12272614B2 · kind B2 · utility
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21References
20Claims
0Family size
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Inventors
Key dates
| Filing date | May 28, 2019 |
| Grant date | Apr 8, 2025 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.