Patent · US Active

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

US12275079B2 · kind B2 · utility

0Cited by

8References

7Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Peter Wiesner · Simbach, DE
Wolfgang Gmach · Emmerting, DE
Robert Kreuzeder · Wurmannsquick, DE

Key dates

Filing date	May 20, 2021
Grant date	Apr 15, 2025
Priority date	—
Expiry date	Jun 27, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/045
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method cuts slices from workpieces using a wire saw having a wire array, which is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings and having a chamber and a shell. The workpiece is fed through the wire array along a feed direction perpendicular to a workpiece axis, while simultaneously changing the shells' lengths by adjusting a temperature of the chambers with a first cooling fluid in accordance with a first correction profile specifying a change in the shells' lengths based on the depth of cut. The floating bearings are simultaneously axially moved by adjusting a temperature of the fixed bearings with a second cooling fluid in accordance with a second correction profile, which specifies a travel of the floating bearings based on the depth of cut. The first correction profile and the second correction profile are opposed to a shape deviation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.