Substrate processing apparatus and substrate processing method
US12276455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M3/226
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pressure container; a depressurizing valve provided in a middle of the discharge line; and a concentration measurement part configured to measure a concentration of vapor of the drying liquid in the fluid flowing through the discharge line, wherein the concentration measurement part is provided on a downstream side of the depressurizing valve of the discharge line and measures the concentration of the drying liquid in the fluid depressurized by the depressurizing valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.