High bandwidth package structure
US12278166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Jul 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method according to the present disclosure includes providing a first workpiece that includes a first substrate and a first interconnect structure, providing a second workpiece that includes a second substrate, a second interconnect structure, and a through via extending through a portion of the second substrate and a portion of the second interconnect structure, forming a first bonding layer on the first interconnect structure, forming a second bonding layer on the second interconnect structure, bonding the second workpiece to the first workpiece by directly bonding the second bonding layer to the first bonding layer, thinning the second substrate, forming a protective film over the thinned second substrate, forming a backside via opening through the protective film and the thinned second substrate to expose the through via, and forming a backside through via in the backside via opening to physically couple to the through via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.