Electronic package and substrate structure thereof
US12278173B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2022 |
| Grant date | Apr 15, 2025 |
| Priority date | — |
| Expiry date | Nov 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage. Therefore, when the encapsulation layer is formed, the exhaust passage can be used to exhaust air, so as to avoid problems such as the occurrence of voids or overflows of the encapsulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.