Material processing method and material processing system for performing the method
US12280445B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2021 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Feb 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A material processing system includes a particle beam column for directing a particle beam at a first processing region and a laser scanner for directing a laser beam at a second processing region. A method for operating the material processing system includes: scanning a first mark placed on an object with the particle beam; scanning the first mark with the laser beam for a first time and producing a second mark on the object with the laser beam; scanning the second mark with the particle beam; and scanning the first mark with the laser beam for a second time and removing material of the object with the laser beam based on the scanning of the second mark with the particle beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.