Programmable interposer using RRAM platform
US12284924B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2022 |
| Grant date | Apr 22, 2025 |
| Priority date | — |
| Expiry date | Dec 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06548
Abstract
According to various embodiments, there may be provided an interposer. The interposer including: a substrate; a dielectric layer disposed on the substrate; a via disposed entirely within the dielectric layer; a resistive film layer disposed to line the via; a metal interconnect disposed in the resistive layer lined via; and a plurality of metal lines disposed in the dielectric layer, the plurality of metal lines including a first metal line connected to the metal interconnect, a second metal line connected to the resistive film layer at a first point, and a third metal line connected to the resistive film layer at a second point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.