Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film
US12285767B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 2, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB07B13/04
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for classifying solder particles includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 included in an electrostatic attraction device, the first electrode 2 having a disposition part having electrostatic diffusivity or electrical conductivity, the second electrode 3 having an attraction part 4 having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts 10 opened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to areas other than the opening parts 10 of the attraction part 4; and a third step of collecting solder particles P1 accommodated in the opening parts, from the attraction part 4 that has been subjected to the second step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.