Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
US12288744B2 · kind B2 · utility
0Cited by
9References
11Claims
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Key dates
| Filing date | May 12, 2022 |
| Grant date | Apr 29, 2025 |
| Priority date | — |
| Expiry date | Jul 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20641
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.