Apparatus and method for processing substrate
US12291029B2 · kind B2 · utility
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1References
15Claims
0Family size
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Key dates
| Filing date | Sep 15, 2022 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/135
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.