Electronic component, manufacturing method thereof, and electronic apparatus
US12292657B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 2024 |
| Grant date | May 6, 2025 |
| Priority date | — |
| Expiry date | May 16, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.