Encapsulation materials for flat optical devices
US12297367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Mar 13, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.