Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
US12297381B2 · kind B2 · utility
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2References
6Claims
0Family size
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Key dates
| Filing date | Jun 10, 2021 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Jan 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6836
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate having a semiconductor substrate, a UV-ray-transmissive support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate. The release layer is a film formed from a releasing agent composition containing a polymer of an ethylenic unsaturated monomer having a tert-butoxycarbonyl group, a photoacid generator, and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.