Substrate processing methods and apparatus
US12297535B2 · kind B2 · utility
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3References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 6, 2019 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Aug 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32834
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and a substrate processing apparatus including a vertical flow reaction chamber, a flow guiding part and a substrate support at a horizontally central area of the reaction chamber, the substrate support residing underneath the flow guiding part, and the flow guiding part forcing the vertical flow from above the flow guiding part to go round the flow guiding part on its downward way towards the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.