Apparatus for plating and method of controlling apparatus for plating
US12297555B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 25, 2020 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Jan 5, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An object is to reduce the field shielding effect of a paddle during plating. There is provided an apparatus for plating that is configured to plate a substrate and comprises a plating tank; an anode placed in the plating tank; a rotation mechanism configured to rotate the substrate in a first direction and in a second direction that is opposite to the first direction; and a control device configured to control the rotation mechanism, such that a time period when the substrate is rotated in the first direction becomes equal to a time period when the substrate is rotated in the second direction or such that a time integrated value of a rotation speed in the first direction becomes equal to a time integrated value of a rotation speed in the second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.