Fabrication method for package structure

US12300511B1 · kind B1 · utility

Assignees

• University of Electronic Science and Technology of China · CN
• Zhuhai YUEXIN Semiconductor Limited Liability Company · CN

Inventors

• Xianming Chen · Longbeilingcun, CN
• Yuanming Chen · Aurora, US
• Lei Feng · Longbeilingcun, CN
• Benxia HUANG · Zhuhai, CN
• Yongzhi Zeng · Longbeilingcun, CN
• Wei He · Beijing, CN
• Yanlin Dong · Longbeilingcun, CN

Key dates

• Filing date: Jan 15, 2025
• Grant date: May 13, 2025
• Expiry date: Jan 15, 2045

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15153
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a dielectric material is laminated to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer, a wiring layer is formed on the dielectric layer, the cavity sacrificial post is removed by etching to form a through cavity, a bonding pad is formed on the wiring layer, a reverse side of a device is mounted on the copper foil in the through cavity, and a terminal of the device is wire-bonded with the bonding pad.