Substrate treating apparatus and substrate treating method
US12300515B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2021 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Oct 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept provides an apparatus for treating a substrate by using a supercritical fluid. In an embodiment, the apparatus may include a process chamber that provides a treatment space, and including a chamber heater that increases a temperature of an interior of the treatment space, a substrate support provided in the treatment space and that supports the substrate, and a substrate heating member that heats a lower surface of the substrate while contacting the lower surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.