Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof
US12300584B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Feb 26, 2024 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Feb 26, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.