Patent · US Active

Method of manufacturing a hybrid device

US12300759B2 · kind B2 · utility

0Cited by

2References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Singer · Regenstauf, DE
Oliver Hellmund · Straubing, DE
Brendan Holland · Regensburg, DE
Matthias Sperl · Mintraching, DE

Key dates

Filing date	Jan 11, 2022
Grant date	May 13, 2025
Priority date	—
Expiry date	May 25, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH10H29/142
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a micro-light-emitting diode display includes processing a wafer to form a plurality of functional chips integral with the wafer. A plurality of wafer tiles is defined in the wafer, wherein each wafer tile is composed of a cluster of functional chips. The wafer tiles are singulated by wafer dicing. A plurality of separate wafer tiles is bonded to a semiconductor wafer by hybrid bonding. The functional chips are singulated together with chips of the semiconductor wafer by dicing the bonded-together wafer tiles and semiconductor wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.