Low loss travelling wave parametric devices using planar capacitors
US12301176B2 · kind B2 · utility
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4References
20Claims
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Key dates
| Filing date | Sep 15, 2022 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Nov 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/805
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.