Optimised laser cutting
US12304001B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2019 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of cutting a wafer by irradiating the wafer with laser energy, comprises emitting a sequence of successive laser beam pulses having a first set of laser beam pulses and a second set of laser beam pulses, the first set of laser beam pulses comprising: laser beam pulses having respective pulse widths in the range from 0.1 to 300 nanoseconds, or a plurality of bursts of laser beam pulses having an inter-burst spacing in the range from 0.1 to 100 nanoseconds, each pulse within the bursts having a pulse width of 100 picoseconds or less, and the second set of laser beam pulses comprising laser beam pulses having pulse widths of 100 picoseconds or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.