Method for identifying wafer
US12307646B2 · kind B2 · utility
0Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Aug 1, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for identifying a wafer is provided, which includes the following steps. A marked frame is obtained from a wafer inspection picture. A gray scale index corresponding to the marked frame is calculated based on a gray scale value corresponding to each of multiple pixels included in the marked frame. The gray scale index indicates a proportion of pixels whose gray scale values are greater than a specified value. Whether a trace pattern in the marked frame is a scratch or a grain boundary is determined based on the gray scale index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.