Point of load module and heatsink therefor
US12309910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2024 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Jan 2, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a point of load (POL) module. The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The POL module is configured to be surface mounted. The system further includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL module and configured to connect to the power network. The power network may be a PGND network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.