Circuit board having embedded electronic component and method for manufacturing the same
US12309918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Jun 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10651
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.