Ming-Hsun Lee
13Patents
4h-index
14Co-inventors
57Inventor score
Filing activity: Jan 30, 2001 → Nov 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6603196B2 | Leadframe-based semiconductor package for multi-media card | Electricity | 172 | Expired |
| US6388313B1 | Multi-chip module | Electricity | 99 | Expired |
| US7375415B2 | Die package with asymmetric leadframe connection | Electricity | 15 | Expired |
| US7728411B2 | COL-TSOP with nonconductive material for reducing package capacitance | Electricity | 6 | Active |
| US8097495B2 | Die package with asymmetric leadframe connection | Electricity | 4 | Active |
| US6861736B2 | Leadframe-based semiconductor package for multi-media card | Electricity | 2 | Expired |
| US9909305B2 | Composite wall assembly | Emerging Cross-Sectional Technologies | 2 | Active |
| US10623646B1 | Camera system and imaging method of camera system | Physics | 1 | Active |
| US8575739B2 | Col-based semiconductor package including electrical connections through a single layer leadframe | Electricity | 0 | Active |
| US12309918B2 | Circuit board having embedded electronic component and method for manufacturing the same | Electricity | 0 | Active |
| US11736785B2 | Camera module | Electricity | 0 | Active |
| US11573784B2 | Electronic device for updating on-board data of power off status and electronic device package assembly | Physics | 0 | Active |
| US11852944B2 | Electrochromic module, camera module, and electronic device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.