Magnetically secured semiconductor chip package loading assembly
US12309933B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2021 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Aug 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/104
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.