Solid-state imaging device and imaging device with shared circuit elements
US12310136B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Aug 7, 2020 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | Feb 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/199
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging device includes a plurality of unit pixels disposed into pixel groups that are separated from one another by isolation structures. Unit pixels within each pixel group are separated from one another by isolation structures and share circuit elements. The isolation structures between pixel groups are full thickness isolation structures. At least a portion of the isolation structures between unit pixels within a pixel group are deep trench isolation structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.