Methods and tools for electrical property depth profiling using electro-etching
US12313669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2023 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Aug 13, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2648
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In some embodiments, a method includes forming a mini chamber over a test region, the mini chamber comprising an inlet, an outlet and an electrode, introducing an electrolyte solution into the mini chamber through the inlet, applying an electro-etching potential difference between the electrode and at least one contact region and reducing the thickness of a semiconductor film portion at the test region forming a thinned down semiconductor film portion, replacing the electrolyte solution in the mini chamber with a fluid that is substantially insulating, and determining the electrical property of the thinned down semiconductor film portion while the fluid is in the mini chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.