Through-substrate optical vias

US12313890B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Pooya Tadayon · Portland, US
• Zhichao Zhang · Chandler, US
• Brandon C. Marin · Chandler, US
• Tarek A. Ibrahim · Mesa, US
• Kemal Aygun · Tempe, US
• Stephen Andrew Smith · Co-op Village, US

Key dates

• Filing date: Jun 16, 2021
• Grant date: May 27, 2025
• Expiry date: Sep 27, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/1213
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.