Stephen Andrew Smith
5Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Apr 3, 2018 → Jul 19, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10672693B2 | Integrated circuit structures in package substrates | Electricity | 2 | Active |
| US11107757B2 | Integrated circuit structures in package substrates | Electricity | 1 | Active |
| US11804426B2 | Integrated circuit structures in package substrates | Electricity | 0 | Active |
| US12003023B2 | In-package 3D antenna | Electricity | 0 | Active |
| US12313890B2 | Through-substrate optical vias | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.