Semiconductor process modeling system and method
US12314653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jan 12, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor process modeling system. The semiconductor process modeling system includes a preprocessing component configured to generate tensor data from raw data obtained from semiconductor manufacturing equipment, wherein, when the raw data is expressed as a raw matrix representing values of a plurality of process parameters for each of a plurality of wafers, at least one element of the raw matrix is omitted, when the tensor data is expressed as a tensor matrix representing values of a plurality of preprocessed process parameters for each of the plurality of wafers, the number of omitted elements of the tensor matrix is less than the number of omitted elements of the raw matrix, and the preprocessing component is configured to generate the tensor data by modifying the raw data based on at least one of characteristics of the semiconductor manufacturing equipment and characteristics of the plurality of process parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.