Workpiece handling architecture for high workpiece throughput
US12315747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Sep 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for transferring semiconductor workpieces from a load lock to an orientation station and on to a platen is disclosed. The system comprises two load locks, two robots, and one orientation station. Each robot is associated with a respective load lock and follows a fixed sequence. The robot returns a processed workpiece to the load lock and also removes an unprocessed workpiece. The robot then moved to the orientation station, where it removes an aligned workpiece from the orientation station and deposits the unprocessed workpiece on the orientation station. Next, the robot moves to the platen, where it removes a processed workpiece and deposits the aligned workpiece. The robot then returns to the load lock and repeats this sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.