Integrated circuit with a ring-shaped hot spot area and multidirectional cooling
US12315783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2021 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.