Stimulus responsive polymer films and formulations
US12322588B2 · kind B2 · utility
0Cited by
14References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2020 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Mar 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.