Substrate laser processing method and substrate laser processing apparatus
US12322656B2 · kind B2 · utility
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Key dates
| Filing date | Dec 9, 2020 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Jan 26, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.