Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces
US12324102B2 · kind B2 · utility
0Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2023 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10984
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor storage device such as an SSD includes a pliable printed circuit board (PCB) having semiconductor memory devices mounted by solder balls on first and second opposed major surfaces. The memory devices are mounted so as to be staggered and/or partially overlapping with each other on the first and second surfaces of the PCB in at least one direction. The staggered arrangement allows the PCB to flex upon warping of the memory devices mounted on the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.