Component cooler with spring mechanism
US12324130B2 · kind B2 · utility
0Cited by
14References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Apr 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. The apparatus further includes a first spring mechanism between the manifold and the heat transfer element. The first spring mechanism is configured to apply a first force to the heat transfer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.