Method and system for uniformly irradiating a frame of a processed substrate
US12325085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Mar 12, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for uniformly irradiating a frame of a processed substrate, the processed substrate including a plurality of frames, two consecutive frames being separated by an intermediate zone, the method includes steps of: determining an initial position of the processed substrate using a detecting unit; comparing the detected initial position with a first predetermined position associated with a first frame of the processed substrate; irradiating the first frame of the processed substrate by an irradiation beam emitted by a source unit and scanned by a scanning unit based on the first predetermined position, the irradiation beam being adapted to cover uniformly the whole first frame. A system for uniformly irradiating a frame of a processed substrate is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.