Platinum-based sputtering target, and method for producing the same
US12325908B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 15, 2021 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Nov 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/14
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a platinum-based sputtering target containing platinum or a platinum alloy. The platinum-based sputtering target of the present invention is characterized by a material structure in a thickness-direction cross section thereof. Specifically, when a thickness-direction cross section is equally divided into n sections (n=5 to 20) along a thickness direction, a region including (n−2) sections excluding both end sections is set as a determination region, and when an average grain size in each of the sections is measured in the determination region, as well as an average grain size in the entire determination region is measured, the average grain size in the entire determination region is 150 μm or less, and a coefficient of variation calculated based on the average grain size in each of the sections of the determination region is 15% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.