Ultrasonic transducer
US12326998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2023 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Aug 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/96015
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.