Semiconductor processing apparatus and method
US12327748B2 · kind B2 · utility
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44References
4Claims
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Key dates
| Filing date | Nov 5, 2021 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Feb 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This application relates to a semiconductor processing apparatus and method. In an embodiment of this application, the semiconductor processing apparatus includes: a wafer pocket provided with a lower electrode, where the lower electrode is coupled to a direct-current power supply; and an upper electrode disposed opposite to the wafer pocket, where the upper electrode is coupled to a radio frequency generator through a matching circuit, and is grounded through a low-pass filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.