Probe pad with built-in interconnect structure

US12327770B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Ashim Dutta · Clifton Park, US
• Ruturaj Nandkumar Pujari · Albany, US
• Saumya Sharma · Easton, US
• Chih-Chao Yang · Glenmont, US

Key dates

• Filing date: Nov 29, 2021
• Grant date: Jun 10, 2025
• Expiry date: Oct 11, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2223/54453
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system includes a wafer including at least an electronic component and a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component. The electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer. The probe pad is aligned with the wafer by using alignment marks. A prober alignment camera is employed to locate the alignment marks.