Inventor · Clifton Park, NY, US

Ashim Dutta

82Patents
4h-index
58Co-inventors
65Inventor score

Filing activity: Jul 1, 2014 → Jul 13, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10707413B1 Formation of embedded magnetic random-access memory devices Electricity 19 Active
US10879107B2 Method of forming barrier free contact for metal interconnects Electricity 9 Active
US10833257B1 Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts Electricity 7 Active
US10957850B2 Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication Electricity 4 Active
US11223008B2 Pillar-based memory hardmask smoothing and stress reduction Electricity 4 Active
US10685879B1 Lithographic alignment of a conductive line to a via Electricity 4 Active
US10833258B1 MRAM device formation with in-situ encapsulation Electricity 3 Active
US10672611B2 Hardmask stress, grain, and structure engineering for advanced memory applications Electricity 2 Active
US9679852B2 Semiconductor constructions Electricity 2 Active
US11502242B2 Embedded memory devices Electricity 1 Active
US11227892B2 MRAM integration with BEOL interconnect including top via Electricity 1 Active
US9984977B2 Semiconductor constructions Electricity 1 Active
US11437083B2 Two-bit magnetoresistive random-access memory device architecture Electricity 1 Active
US11744083B2 Fabrication of embedded memory devices utilizing a self assembled monolayer Electricity 1 Active
US10796911B2 Hardmask stress, grain, and structure engineering for advanced memory applications Electricity 1 Active
US10615037B2 Tone reversal during EUV pattern transfer using surface active layer assisted selective deposition Electricity 1 Active
US10672618B2 Systems and methods for patterning features in tantalum nitride (TaN) layer Electricity 1 Active
US11495538B2 Fully aligned via for interconnect Electricity 1 Active
US11121173B2 Preserving underlying dielectric layer during MRAM device formation Electricity 1 Active
US12183630B2 Additive interconnect formation Electricity 0 Active
US12327770B2 Probe pad with built-in interconnect structure Electricity 0 Active
US11205678B2 Embedded MRAM device with top via Electricity 0 Active
US11189783B2 Embedded MRAM device formation with self-aligned dielectric cap Electricity 0 Active
US11189561B2 Placing top vias at line ends by selective growth of via mask from line cut dielectric Electricity 0 Active
US11158786B2 MRAM device formation with controlled ion beam etch of MTJ Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.